Description

Features

Cool shape, strong core
Flying wing shape, with imitation carbon fiber surface treatment; using the best multi-layer circuit board, greatly extending the life of the memory module, using 2 ounces of copper foil, can not only greatly reduce impedance, reduce losses, improve reliability, but also facilitate the particle The internal heat is quickly conducted to the PCB for heat dissipation.
Severe cold struck, calmly respond
Using TCT heat conduction technology.
Support Intel memory XMP2.0 technology
The Z1 has all built-in Intel XMP 2.0 versions, which can be used after inserting the memory. One click enjoys the fast speed and system reliability, and overclocking is more worry-free.

Specification